Electroplated nickel gold is more commonly utilized on IC substrates (such as PBGA), mainly for binding gold wires and copper wires; but when electroplating C substrates, additional conductive wires must be created on the gold finger binding position in advance of electroplating. Zachariah Peterson has an intensive specialized history in https://lanevxaaa.blog-gold.com/38984063/goldfinger-pcb-for-electronics-industry-secrets